Multilayer capacitor and board having the same mounted thereon

ABSTRACT

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the continuation application of U.S. patentapplication Ser. No. 16/779,960 filed on Feb. 3, 2020, which claims thebenefit under 35 USC 119(a) of Korean Patent Application No.10-2019-0100293 filed on Aug. 16, 2019 in the Korean IntellectualProperty Office, the entire disclosures of which are incorporated hereinby reference for all purposes.

TECHNICAL FIELD

The present disclosure relates to a multilayer capacitor and a boardhaving the same mounted thereon.

BACKGROUND

A multilayer capacitor is widely used as an information technology (IT)component of a computer, a personal digital assistant (PDA), a mobilephone, and the like, due to advantageous thereof such as small size,high capacitance, and ease of mounting. Also, the multilayer capacitoris widely used as an electrical component due to characteristics thereofsuch as high reliability and high strength.

With the recent trend for miniaturization and multifunctionalization ofelectronic devices, a multilayer capacitor is also required to have asmall size and high capacitance. To this end, a multilayer capacitor,having a structure in which an internal electrode is exposed in a widthdirection of a capacitor body to significantly increase an area of theinternal electrode in the width direction, has been manufactured.

In a multilayer capacitor having such a structure, a capacitor body ismanufactured and side portions are respectively attached to bothsurfaces of the capacitor body in the width direction during apre-sintering process, such that the side portions cover exposedportions of the internal electrode.

However, a multilayer capacitor, having such a structure in which sideportions are attached after the internal electrode is exposed in a widthdirection of a capacitor body as described above, may suffer fromdegradation in moisture resistance reliability and toughness resultingfrom shrinkage after sintering.

SUMMARY

An aspect of the present disclosure is to provide a multilayercapacitor, capable of increasing capacitance and improving moistureresistance reliability and toughness, and a mounting board of themultilayer capacitor.

According to an aspect of the present disclosure, a multilayer capacitorincludes a capacitor body including dielectric layers and first andsecond internal electrodes, the capacitor body having a first surfaceand a second surface opposing each other, a third surface and a fourthsurface, connected to the first surface and the second surface andopposing each other, and a fifth surface and a sixth surface, connectedto the third surface and the fourth surface and opposing each other, thefirst internal electrode being exposed through the third, fifth, andsixth surfaces, and the second internal electrode being exposed throughthe fourth, fifth, and sixth surfaces, a first side portion and a secondside portion, respectively disposed on the fifth surface and the sixthsurface of the capacitor body, and a first external electrode and asecond external electrode, respectively connected to the third surfaceand the fourth surface of the capacitor body to be respectivelyconnected to the first internal electrode and the second internalelectrode. The first and second side portions include an acicular secondphase including a glass including aluminum (Al) and silicon (Si),manganese (Mn), and phosphorus (P).

A major axis of the second phase of the first and second side portionsmay have a length of 1 to 10 μm.

The dielectric layer may have an average thickness of 0.4 μm or less.

Each of the first and second internal electrodes may have an averagethickness of 0.41 μm or less.

The number of the first and second internal electrodes laminated may be400 or more.

Each of the first and second side portions may have an average thicknessof 10 to 20 μm.

The capacitor body may include an active region, in which the first andsecond internal electrodes overlap each other, and upper and lower coverregions, respectively disposed on upper and lower surfaces of the activeregion.

Each of the upper and lower cover regions may have a thickness of 20 μmor less.

Each of the first and second external electrodes may have an averagethickness of 10 μm or less.

The first and second external electrodes may respectively include firstand second connection portions, respectively disposed on the third andfourth surfaces of the capacitor body to be respectively connected tothe first and second internal electrodes, and first and second bandportions, respectively extending from the first and second connectionportions to a portion of the first surface of the capacitor body.

According to another aspect of the present disclosure, a mounting boardof a multilayer capacitor includes a substrate, including first andsecond electrode pads on one surface thereof, and a multilayer capacitormounted such that first and second external electrodes are respectivelyconnected to the first and second electrode pads.

According to another aspect of the present disclosure, a multilayercapacitor includes a capacitor body including dielectric layers andfirst and second internal electrodes, the capacitor body having a firstsurface and a second surface opposing each other, a third surface and afourth surface, connected to the first surface and the second surfaceand opposing each other, and a fifth surface and a sixth surface,connected to the third surface and the fourth surface and opposing eachother, the first internal electrode being exposed through the third,fifth, and sixth surfaces, and the second internal electrode beingexposed through the fourth, fifth, and sixth surfaces; a first sideportion and a second side portion, respectively disposed on the fifthsurface and the sixth surface of the capacitor body; and a firstexternal electrode and a second external electrode, respectivelyconnected to the third surface and the fourth surface of the capacitorbody to be respectively connected to the first internal electrode andthe second internal electrode. Each of the first and second sideportions comprises one acicular second phase and another acicular secondphase physically crosslinked. Each of the one acicular second phase andthe another acicular second phase includes manganese (Mn), phosphorus(P), and a glass comprising aluminum (Al) and silicon (Si).

A major axis of each of the one acicular second phase and the anotheracicular second phase may have a length of 1 to 10 μm.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating a multilayer capacitoraccording to an embodiment of the present disclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 ;

FIGS. 3A and 3B are plan views illustrating laminated structures offirst and second internal electrodes of the multilayer capacitor in FIG.1 , respectively;

FIG. 4 is a cross-sectional view taken along line II-II′ in FIG. 1 ;

FIG. 5 is a cross-sectional view taken along line in FIG. 1 ; and

FIG. 6 is a schematic cross-sectional view of a board on which themultilayer capacitor, illustrated in FIG. 1 , is mounted.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

However, the present disclosure may be embodied in many different formsand should not be construed as being limited to the embodiments setforth herein.

Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art.

Accordingly, the shapes and dimensions of elements in the drawings maybe exaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

Further, the same reference numerals are used throughout the drawingsfor the elements having similar functions and activities.

In the specification, unless otherwise specifically indicated, when acertain part “includes” a certain component, it is understood that othercomponents may be further included but are not excluded.

To clearly describe the example embodiments, X, Y, and Z indicated inthe drawings are defined to represent a length direction, a widthdirection, and a thickness direction of a multilayer capacitor,respectively.

Additionally, the Z direction may be used in the same sense as alamination direction in which the dielectric layers are laminated.

FIG. 1 is a perspective view illustrating a multilayer capacitoraccording to an embodiment of the present disclosure, FIG. 2 is across-sectional view taken along line I-I′ in FIG. 1 , FIGS. 3A and 3Bare plan views illustrating laminated structures of first and secondinternal electrodes of the multilayer capacitor in FIG. 1 ,respectively, FIG. 4 is a cross-sectional view taken along line II-II′in FIG. 1 , and FIG. 5 is a cross-sectional view taken along lineIII-III′ in FIG. 1 .

Hereinafter, a multilayer capacitor according to this embodiment will bedescribed with reference to FIGS. 1 to 5 .

Referring to FIGS. 1 to 5 , a multilayer capacitor 100 includes acapacitor body 110, first and second side portions 141 and 142, andfirst and second external electrodes 131 and 132.

The capacitor body 110 is in a sintered state after a plurality ofdielectric layers 111 are laminated in a Z direction, and adjacentdielectric layers 111 may be integrated with each other such thatboundaries therebetween are not readily apparent without a scanningelectron microscope (SEM).

The capacitor body 110 may include a plurality of dielectric layers 111and first and second internal electrodes 121 and 122, having polaritiesopposite to each other, alternately disposed in the Z direction withrespective dielectric layers 111 interposed therebetween.

The capacitor body 110 may include an active region, as a portioncontributing to forming capacitance of a capacitor, in which the firstand second internal electrodes 121 and 122 are alternately disposed withrespective dielectric layers 111 interposed therebetween, and upper andlower cover regions 112 and 113, provided on upper and lower surfaces ofthe active regions in the Z direction, as a margin portion.

In this case, each of the upper and lower cover regions 112 and 113 mayhave a thickness of 20 μm or less.

A shape of the capacitor body 110 is not limited, but may besubstantially hexahedral. The capacitor body 110 may have first andsecond surfaces 1 and 2 opposing each other in the Z direction, thirdand fourth surfaces 3 and 4, connected to the first and second surfaces1 and 2, opposing each other in an X direction, and fifth and sixthsurfaces 5 and 6, connected to the first and second surfaces 1 and 2 aswell as to the fifth and sixth surfaces 5 and 6, opposing each other ina Y direction. In this embodiment, the first surface 1 may be amountedsurface of the multilayer capacitor 100.

The dielectric layer 111 may include ceramic power particles, forexample, BaTiO₃-based ceramic powder particles.

The BaTiO₃ (BT)-based ceramic powder may be (Ba_(1-x)Ca_(x)) TiO₃,Ba(Ti_(1-y)Ca_(y)) O₃, (Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y)) O₃, orBa(Ti_(1-y)Zr_(y)) O₃, prepared by partially employing cesium (Ca),zirconium (Zr), and the like, in BaTiO₃, but the present disclosure isnot limited thereto.

A ceramic additive, an organic solvent, a plasticizer, a binder, adispersant, and the like, may be further added to the dielectric layer111, together with the ceramic powder particles.

The ceramic additive may include, for example, a transition metal oxideor a transition metal carbide, a rare earth element, magnesium (Mg),aluminum (Al), or the like.

The first and second internal electrodes 121 and 122 are electrodes towhich opposite polarities are applied, and may be disposed on respectivedielectric layers 111 to be alternately laminated in the Z direction andmay be alternately disposed inside the capacitor body in the Z directionwith a single dielectric layer 111 therebetween.

In this case, the first and second internal electrodes 121 and 122 maybe electrically insulated from each other by the dielectric layer 111disposed therebetween.

The first internal electrode 121 is exposed through the third, fifth,and sixth surfaces 3, 5 and 6 of the dielectric layer 111.

In this case, the first internal electrode 121 may also be exposedthrough a corner, connecting the third surface 3 and the fifth surface 5of the capacitor body 110, and a corner connecting the third surface 3and the sixth surface 6 of the capacitor body 110.

The second internal electrode 122 is exposed through the fourth, fifth,and sixth surfaces 4, 5, and 6 of the dielectric layer 111.

In this case, the second internal electrode 122 may also be exposedthrough a corner, connecting the fourth surface 4 and the fifth surface5 of the capacitor body 110, and a corner connecting the fourth surface4 and the sixth surface 6 of the capacitor body 110.

In this case, end portions of the first and second internal electrodes121 and 122, alternately exposed through the third and fourth surfaces 3and 4 of the capacitor body 110, may be connected to the first andsecond external electrodes 131 and 132 disposed on both end portions ofthe capacitor body 110 in the X direction to electrically connectedthereto, respectively.

According to the above configuration, charges are accumulated betweenthe first and second internal electrodes 121 and 122 when apredetermined voltage is applied to the first and second externalelectrodes 131 and 132.

In this case, capacitance of the multilayer capacitor 100 is inproportion to an overlapping area of the first and second internalelectrodes 121 and 122 overlapping each other in the Z direction in anactive region.

As in this embodiment, when the first and second internal electrodes 121and 122 are configured, not only basic areas of the first and secondinternal electrodes 121 and 122 but also a vertically overlapping areathereof is increased. Therefore, the capacitance of the multilayercapacitor 100 may be increased.

For example, when the area of the overlapping region of the first andsecond internal electrodes 121 and 122 is significantly increased,capacitance of a capacitor having even the same size may besignificantly increased.

In addition, since a step, caused by lamination of internal electrodes,may be reduced to improve accelerated lifespan of insulation resistance,the multilayer capacitor 100 having improved capacitance characteristicsand improved reliability may be provided.

In this case, a material of the first and second internal electrodes 121and 122 is not limited, and the first and second internal electrodes 121and 122 may be formed using a conductive paste including a preciousmetal material or at least one of nickel (Ni) and copper (Cu).

The conductive paste may be printed by screen printing, gravureprinting, or the like, but a printing method of the conductive paste isnot limited thereto.

An average thickness of the first and second internal electrodes 121 and122 may be determined depending on purposes thereof and may be, forexample, 0.41 μm or less.

In addition, the total number of the laminated first and second internalelectrodes 121 and 122 may be 400 or more.

Accordingly, the multilayer capacitor 100 according to an exampleembodiment may be used as a component, requiring a large size and highcapacitance, such as an IT component.

The first side portion 141 is disposed on the fifth surface 5 of thecapacitor body 110, and the second side portion 142 is disposed on thesixth surface 6 of the capacitor body 110.

The first and second side portions 141 and 142 are in contact with tipsof portions, exposed through the fifth and sixth surfaces 5 and 6 of thecapacitor body from the first and second internal electrodes 121 and122, to cover the tips.

The first and second side portions 141 and 142 serve to protect thecapacitor body 110 and the first and second internal electrodes 121 and122 from external impact and the like, and to secure insulationproperties and moisture resistance reliability in the vicinity of thecapacitor body 110.

The first and second side portions 141 and 142 include an acicularmullite second phase including a glass including aluminum (Al) andsilicon (Si), manganese (Mn), and phosphorous (P). For example, theacicular mullite second phase includes manganese (Mn), phosphorous (P),and a glass including aluminum (Al) and silicon (Si). In one example,the first and second side portions 141 and 142 may be made of a materialdifferent from that of the dielectric layer 111.

Such a mullite second phase of this embodiment may be physicallycrosslinked to an adjacent mullite second phase to be physically linkedthereto.

Accordingly, the first and second side parts 141 and 142 may have betterresistance against external physical impact and may block a moisturepenetration path into the capacitor body 110.

In addition, the second phase of the present disclosure may improvegrain density of the first and second side portions 141 and 142depending on a chemical low-temperature sintering action.

Accordingly, the first and second side parts 141 and 142 may have betterresistance against external physical impact, and the water penetrationpath of the ceramic body 110 may be blocked.

The mullite second phase of this embodiment may improve the moistureresistance reliability and hardness of the capacitor body 110 to berelatively higher than those of other second phases, for example, aphosphate second phase.

An average thickness of the first and second side portions 141 and 142in the Y direction may be 10 to 20 μm. In one example, an averagethickness of each of the first and second side portions 141 and 142 inthe Y direction may be 10 to 20 μm.

When the average thickness of the first and second side portions 141 and142 in the Y direction is low, a ratio of the capacitor body 110 in amultilayer capacitor having the same standard may be increased. Thus,the capacitance of the multilayer capacitor 100 may also be increased.

In general, when an average thickness of the side portion is low, themoisture resistance reliability and toughness of the side portion may bedegraded. However, the multilayer capacitor 100 according to thisembodiment may include the first and second side portions 141 and 142,including the second phase, to prevent degradation in reliability andtoughness of the multilayer capacitor 100 even when the averagethickness of the first and second side portions 141 and 142 is low.

The acicular mullite second phase included in the first and second sideportions 141 and 142 may have an acicular shape having a major axis anda minor axis.

In each of the first and second side portions 141 and 142, the majoraxis of the second phase may have a length of 1 to 10 μm.

When the major axis of the second phase of each of the first and secondside portions 141 and 142 has a short length of 10 μm or less, moistureresistance reliability and hardness of the first and second sideportions 141 and 142 and the capacitor body 110 may be degraded.

However, as in this embodiment, when the first and second side portions141 and 142 include an acicular mullite second phase including a glassincluding Al and Si, Mn, and P, degradation in moisture resistancereliability and hardness of the first and second side portions 141 and142 may be prevented even if the major axis of the second phase of eachof the first and second side portions 141 and 142 has a length of 10 μmor less.

A phosphate-based glass according to the related art forms an acicularsecond phase after sintering. A second phase having a mullitecomposition according to this embodiment may have an acicular shape andmay have a major axis having a larger size and a higher thickness than amajor axis of a phosphate-based second phase including only a common Pcomponent. Thus, the moisture resistance and the hardness of the firstand second side parts 141 and 142 may be further improved.

The first and second external electrodes 131 and 132 may be providedwith voltages of polarities opposite to each other, and may be disposedon both end portions of the body 110 in the X direction. The first andsecond external electrodes 131 and 132 may be connected to portionsexposed through the third and fourth surfaces 3 and 4 of the capacitorbody 110 to be electrically connected thereto, respectively.

In this case, the first and second external electrodes 131 and 132 mayhave an average thickness of 10 μm or less. In one example, each of thefirst and second external electrodes 131 and 132 may have an averagethickness of 10 μm or less.

Accordingly, the multilayer capacitor 100 may be miniaturized, and themanufacturing costs of the multilayer capacitor 100 may be reduced.

When the thickness of each of the first and second external electrodes131 and 132 is low, the moisture resistance reliability and the hardnessof the capacitor body 110 may be generally degraded. However, in thisembodiment, the first and second side portions 141 and 142 include anacicular second phase including a glass including Al and Si, Mn, and Pto prevent degradation in moisture resistance reliability and hardnesseven if each of the first and second external electrodes 131 and 132 hasa thickness of 10 μm or less. As a result, miniaturization and reducedmanufacturing costs of the multilayer capacitor 100 may be expected.

The first external electrode 131 may include a first connection portion131 a and a first band portion 131 b.

The first connection portion 131 a is disposed on the third surface 3 ofthe capacitor body 110 and is in contact with an end portion, exposedoutwardly of the first internal electrode 121 through the third surface3 of the capacitor body 110, to physically and electrically connect thefirst internal electrode 121 and the first external electrode 131 toeach other.

The first band portion 131 b is a portion extending from the firstconnection portion 131 a to a portion of the first surface 1 of thecapacitor body 110.

As necessary, in order to improve adhesive strength and the like, thefirst band portion 131 b may further extend to the second, fifth, andsixth surfaces 2, 5, and 6 of the capacitor body 110 to cover one endportion of the side portions 141 and 142.

The second external electrode 132 may include a second connectionportion 132 a and a second band portion 132 b.

The second connection portion 132 a is disposed on the fourth surface 4of the capacitor body 110 and is in contact with an end portion, exposedoutwardly of the second internal electrode 122 through the fourthsurface 4 of the capacitor body 110, to physically and electricallyconnect the second internal electrode 122 and the second externalelectrode 132 to each other.

Each of the first and second external electrodes 131 and 132 may includea plating layer for at least a portion of structural reliability, easeof board mounting, durability to the outside, heat resistance, andequivalent series resistance (ESR).

For example, the plating layer may be formed by sputtering or electricdeposition, but a method of forming the plating layer is not limitedthereto.

The plating layer may include a largest amount of nickel, but is notlimited thereto. The plating layer may be implemented using copper (Cu),palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb) alone,or alloys including at least one thereof.

According to this embodiment, the first and second side portions 141 and142 include an acicular mullite second phase including a glass includingAl and Si, Mn, and P. As a result, the strength of the first and secondside portions 141 and 142 may be improved by 30% or more, as comparedwith the side portions, not including the second phase.

In addition, cracking resistance of the first and second side portions141 and 142 may be increased to improve the moisture resistancereliability of the multilayer capacitor 100.

In this embodiment, the dielectric layer 111 may have an averagethickness of 0.4 μm or less. Since the thickness of the dielectric layer111 corresponds to a distance between the first and second internalelectrodes 121 and 122, the capacitance of the multilayer capacitor 100may be improved when the thickness of the dielectric layer 111 is low.

The first and second internal electrodes 121 and 122 may have an averagethickness of be 0.41 μm or less. For example, each of the first andsecond internal electrodes 121 and 122 may have an average thickness ofbe 0.41 μm or less.

Since the multilayer capacitor 100 of this embodiment has a structure inwhich the first and second internal electrodes 121 and 122 are exposedthrough the fifth and sixth surfaces 5 and 6 of the capacitor body 110,a step with respect to the capacitor body 110 may be reduced on endportions of the first and second internal electrodes 121 and 122 in theY direction.

Accordingly, even when the thickness of the dielectric layer 111 and thefirst and second internal electrodes 121 and 122 is reduced as describedabove to achieve multilayer thinning, there is no significant problemwith the reliability of the multilayer capacitor 100. Therefore, thereliability may also be secured while increasing the capacity of thecapacitor 100.

In addition, when the average thickness of the first and second internalelectrodes 121 and 122 is reduced as described above, shrinkage aftersintering may be decreased. Therefore, a diameter of a void in the endportion of the capacitor body 110 may be further reduced to furtherimprove the reliability of the multilayer capacitor 100.

Referring to FIG. 6 , a mounting board of a multilayer capacitoraccording to this embodiment may include a substrate 210, includingfirst and second electrode pads 221 and 222 on one surface thereof, anda multilayer capacitor 100 mounted such that first and second externalelectrodes 131 and 141 are respectively connected to the first andsecond electrode pads 221 and 222 on an upper surface of the substrate210.

In this embodiment, the multilayer capacitor 100 is illustrated anddescribed as being mounted on the substrate 210 by solders 231 and 232but, as necessary, a conductive paste may be used rather than a solder.

As described above, an internal electrode may be exposed in a widthdirection of a capacitor body to increase capacitance of a multilayercapacitor, and a side portion may include an acicular mullite secondphase including a glass including Al and Si, Mn, and P to improvemoisture resistance reliability and toughness of the multilayercapacitor depending on a physical crosslinking action and a chemicallow-temperature sintering action of the second phase of the sideportion.

While embodiments have been shown and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

What is claimed is:
 1. A multilayer capacitor comprising: a capacitorbody including dielectric layers and first and second internalelectrodes, the capacitor body having a first surface and a secondsurface opposing each other, a third surface and a fourth surface,connected to the first surface and the second surface and opposing eachother, and a fifth surface and a sixth surface, connected to the thirdsurface and the fourth surface and opposing each other, the firstinternal electrode being exposed through the third, fifth, and sixthsurfaces, and the second internal electrode being exposed through thefourth, fifth, and sixth surfaces; a first side portion and a secondside portion, respectively disposed on the fifth surface and the sixthsurface of the capacitor body; and a first external electrode and asecond external electrode, respectively connected to the third surfaceand the fourth surface of the capacitor body to be respectivelyconnected to the first internal electrode and the second internalelectrode, wherein the first and second side portions comprise anacicular second phase including a glass comprising aluminum (Al) andsilicon (Si), manganese (Mn), and phosphorus (P), wherein each of thefirst and second internal electrodes has an average thickness of 0.41 μmor less, and wherein the capacitor body comprises an active region, inwhich the first and second internal electrodes overlap each other, andupper and lower cover regions, respectively disposed on upper and lowersurfaces of the active region.
 2. The multilayer capacitor of claim 1,wherein the first and second side portions further comprise anotheracicular second phase including manganese (Mn) and phosphorus (P). 3.The multilayer capacitor of claim 1, wherein a major axis of the secondphase of the first and second side portions has a length of 1 to 10 μm.4. The multilayer capacitor of claim 1, wherein the dielectric layer hasan average thickness of 0.4 μm or less.
 5. The multilayer capacitor ofclaim 1, wherein the number of the first and second internal electrodesis 400 or more.
 6. The multilayer capacitor of claim 1, wherein each ofthe first and second side portions has an average thickness of 10 to 20μm.
 7. The multilayer capacitor of claim 1, wherein each of the upperand lower cover regions has a thickness of 20 μm or less.
 8. Themultilayer capacitor of claim 1, wherein each of the first and secondexternal electrodes has an average thickness of 10 μm or less.
 9. Themultilayer capacitor of claim 1, wherein the first and second externalelectrodes respectively comprise: first and second connection portions,respectively disposed on the third and fourth surfaces of the capacitorbody to be respectively connected to the first and second internalelectrodes; and first and second band portions, respectively extendingfrom the first and second connection portions to a portion of the firstsurface of the capacitor body.
 10. A multilayer capacitor comprising: acapacitor body including dielectric layers and first and second internalelectrodes, the capacitor body having a first surface and a secondsurface opposing each other, a third surface and a fourth surface,connected to the first surface and the second surface and opposing eachother, and a fifth surface and a sixth surface, connected to the thirdsurface and the fourth surface and opposing each other, the firstinternal electrode being exposed through the third, fifth, and sixthsurfaces, and the second internal electrode being exposed through thefourth, fifth, and sixth surfaces; a first side portion and a secondside portion, respectively disposed on the fifth surface and the sixthsurface of the capacitor body; and a first external electrode and asecond external electrode, respectively connected to the third surfaceand the fourth surface of the capacitor body to be respectivelyconnected to the first internal electrode and the second internalelectrode, wherein the first and second side portions comprise anacicular second phase including a glass comprising aluminum (Al) andsilicon (Si), wherein the dielectric layer has an average thickness of0.4 μm or less.
 11. The multilayer capacitor of claim 10, wherein thefirst and second side portions further comprise another acicular secondphase including manganese (Mn) and phosphorus (P).
 12. The multilayercapacitor of claim 10, wherein a major axis of the second phase of thefirst and second side portions has a length of 1 to 10 μm.
 13. Themultilayer capacitor of claim 10, wherein the number of the first andsecond internal electrodes is 400 or more.
 14. The multilayer capacitorof claim 10, wherein each of the first and second side portions has anaverage thickness of 10 to 20 μm.
 15. The multilayer capacitor of claim10, wherein the capacitor body comprises an active region, in which thefirst and second internal electrodes overlap each other, and upper andlower cover regions, respectively disposed on upper and lower surfacesof the active region.
 16. The multilayer capacitor of claim 15, whereineach of the upper and lower cover regions has a thickness of 20 μm orless.
 17. The multilayer capacitor of claim 10, wherein each of thefirst and second external electrodes has an average thickness of 10 μmor less.
 18. The multilayer capacitor of claim 10, wherein the first andsecond external electrodes respectively comprise: first and secondconnection portions, respectively disposed on the third and fourthsurfaces of the capacitor body to be respectively connected to the firstand second internal electrodes; and first and second band portions,respectively extending from the first and second connection portions toa portion of the first surface of the capacitor body.
 19. The multilayercapacitor of claim 10, wherein each of the first and second internalelectrodes has an average thickness of 0.41 μm or less.
 20. A multilayercapacitor comprising: a capacitor body including dielectric layers andfirst and second internal electrodes, the capacitor body having a firstsurface and a second surface opposing each other, a third surface and afourth surface, connected to the first surface and the second surfaceand opposing each other, and a fifth surface and a sixth surface,connected to the third surface and the fourth surface and opposing eachother, the first internal electrode being exposed through the third,fifth, and sixth surfaces, and the second internal electrode beingexposed through the fourth, fifth, and sixth surfaces; a first sideportion and a second side portion, respectively disposed on the fifthsurface and the sixth surface of the capacitor body; and a firstexternal electrode and a second external electrode, respectivelyconnected to the third surface and the fourth surface of the capacitorbody to be respectively connected to the first internal electrode andthe second internal electrode, wherein the first and second sideportions comprise an acicular mullite second phase including a glasscomprising aluminum (Al) and silicon (Si).
 21. The multilayer capacitorof claim 20, wherein the first and second side portions further compriseanother acicular second phase including manganese (Mn) and phosphorus(P).
 22. The multilayer capacitor of claim 20, wherein a major axis ofthe second phase of the first and second side portions has a length of 1to 10 μm.
 23. The multilayer capacitor of claim 20, wherein thedielectric layer has an average thickness of 0.4 μm or less.
 24. Themultilayer capacitor of claim 20, wherein each of the first and secondinternal electrodes has an average thickness of 0.41 μm or less.
 25. Themultilayer capacitor of claim 20, wherein the number of the first andsecond internal electrodes is 400 or more.
 26. The multilayer capacitorof claim 20, wherein each of the first and second side portions has anaverage thickness of 10 to 20 μm.
 27. The multilayer capacitor of claim20, wherein the capacitor body comprises an active region, in which thefirst and second internal electrodes overlap each other, and upper andlower cover regions, respectively disposed on upper and lower surfacesof the active region.
 28. The multilayer capacitor of claim 27, whereineach of the upper and lower cover regions has a thickness of 20 μm orless.
 29. The multilayer capacitor of claim 20, wherein each of thefirst and second external electrodes has an average thickness of 10 μmor less.
 30. The multilayer capacitor of claim 20, wherein the first andsecond external electrodes respectively comprise: first and secondconnection portions, respectively disposed on the third and fourthsurfaces of the capacitor body to be respectively connected to the firstand second internal electrodes; and first and second band portions,respectively extending from the first and second connection portions toa portion of the first surface of the capacitor body.
 31. The multilayercapacitor of claim 20, wherein the dielectric layer has an averagethickness of 0.4 μm or less, and wherein each of the first and secondinternal electrodes has an average thickness of 0.41 μm or less.
 32. Amultilayer capacitor comprising: a capacitor body including dielectriclayers and first and second internal electrodes, the capacitor bodyhaving a first surface and a second surface opposing each other, a thirdsurface and a fourth surface, connected to the first surface and thesecond surface and opposing each other, and a fifth surface and a sixthsurface, connected to the third surface and the fourth surface andopposing each other, the first internal electrode being exposed throughthe third, fifth, and sixth surfaces, and the second internal electrodebeing exposed through the fourth, fifth, and sixth surfaces; a firstside portion and a second side portion, respectively disposed on thefifth surface and the sixth surface of the capacitor body; and a firstexternal electrode and a second external electrode, respectivelyconnected to the third surface and the fourth surface of the capacitorbody to be respectively connected to the first internal electrode andthe second internal electrode, wherein the first and second sideportions comprise an acicular second phase including a glass comprisingaluminum (Al) and silicon (Si), wherein each of the first and secondside portions has an average thickness of 10 to 20 μm.
 33. Themultilayer capacitor of claim 32, wherein the first and second sideportions further comprise another acicular second phase includingmanganese (Mn) and phosphorus (P).
 34. The multilayer capacitor of claim32, wherein a major axis of the second phase of the first and secondside portions has a length of 1 to 10 μm.
 35. The multilayer capacitorof claim 32, wherein the number of the first and second internalelectrodes is 400 or more.
 36. The multilayer capacitor of claim 32,wherein the capacitor body comprises an active region, in which thefirst and second internal electrodes overlap each other, and upper andlower cover regions, respectively disposed on upper and lower surfacesof the active region.
 37. The multilayer capacitor of claim 36, whereineach of the upper and lower cover regions has a thickness of 20 μm orless.
 38. The multilayer capacitor of claim 32, wherein each of thefirst and second external electrodes has an average thickness of 10 μmor less.
 39. The multilayer capacitor of claim 32, wherein the first andsecond external electrodes respectively comprise: first and secondconnection portions, respectively disposed on the third and fourthsurfaces of the capacitor body to be respectively connected to the firstand second internal electrodes; and first and second band portions,respectively extending from the first and second connection portions toa portion of the first surface of the capacitor body.
 40. The multilayercapacitor of claim 32, wherein the dielectric layer has an averagethickness of 0.4 μm or less.
 41. The multilayer capacitor of claim 32,wherein each of the first and second internal electrodes has an averagethickness of 0.41 μm or less.
 42. The multilayer capacitor of claim 32,wherein the dielectric layer has an average thickness of 0.4 μm or less,and wherein each of the first and second internal electrodes has anaverage thickness of 0.41 μm or less.